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Implantable electrical lead including a cooling assembly to dissipate MRI induced electrode heat
专利权人:
Blair Erbstoeszer
发明人:
Blair Erbstoeszer,Brendan E. Koop
申请号:
US12907657
公开号:
US08406895B2
申请日:
2010.10.19
申请国别(地区):
US
年份:
2013
代理人:
摘要:
An implantable medical device lead includes an insulative lead body, an outer conductive coil extending through the lead body, and an inner conductive coil extending coaxially with the outer conductive coil. The outer conductive coil is coupled to a proximal electrode at a distal end of the outer conductive coil, and the inner conductive coil is coupled to a distal electrode at a distal end of the inner conductive coil. A cooling assembly is thermally coupled to the distal electrode to dissipate heat generated at the distal electrode during exposure to magnetic resonance imaging (MRI) fields.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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