PROBLEM TO BE SOLVED: To provide a fingerprint sensor wiring board having high reading sensitivity.SOLUTION: A fingerprint sensor wiring board 100 comprises: an insulating substrate 1 obtained by laminating a plurality of insulating layers 1a and 1b a plurality of surface layer belt-like electrodes 6 for reading a fingerprint, formed on the insulating layer 1b of the top layer and arranged in parallel in a first direction a plurality of inner layer band-like electrodes 8 for reading a fingerprint, formed on the insulating layer 1a of the next layer contacting the insulating layer 1b of the top layer and arranged in parallel in a second direction orthogonal to the first direction a pad electrode 7 formed on the insulating layer 1b of the top layer and arranged on the inner layer band-like electrode 8 and between the surface layer band-like electrodes 6 and a via conductor 9 formed so as to penetrate the insulating layer 1b of the outermost layer between the pad electrode 7 and the inner layer band-like electrode 8 and electrically connecting the pad electrode 7 with the inner layer band-like electrode 8. The via conductor 9 has an oval shape long in the first direction in a top surface view.SELECTED DRAWING: Figure 4COPYRIGHT: (C)2018,JPO&INPIT【課題】読み取り感度が高い指紋センサー用配線基板を提供すること。【解決手段】複数の絶縁層1a,1bが積層されて成る絶縁基板1と、最上層の絶縁層1b上に形成されており、第1の方向に沿って並設された指紋読み取り用の複数本の表層帯状電極6と、最上層の絶縁層1bに接する次層の絶縁層1a上に形成されており、第1の方向と直交する第2の方向に沿って並設された指紋読み取り用の複数本の内層帯状電極8と、最上層の絶縁層1b上に形成されており、内層帯状電極8上で、かつ表層帯状電極6同士の間に配置されたパッド電極7と、該パッド電極7と内層帯状電極8との間の最表層の絶縁層1bを貫通して形成されており、パッド電極7と内層帯状電極8とを電気的に接続するビア導体9と、を具備して成る指紋センサー用配線基板100であって、ビア導体9は、上面視で第1の方向に長い長円形状である。【選択図】図4
