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MODIFIABLE IMPLANTS
专利权人:
发明人:
Roderick A. Hyde,Muriel Y. Ishikawa,Robert Langer,Eric C. Leuthardt,Stephen L. Malaska,Lowell L. Wood, JR.
申请号:
US14710458
公开号:
US20160331539A1
申请日:
2015.05.12
申请国别(地区):
US
年份:
2016
代理人:
摘要:
Embodiments disclosed herein are directed to implants having a modifiable structural connectivity between one or more members thereof. In an embodiment, a modifiable implant includes a first member coupled to a second member by a reactive composite material having a release mechanism therein. A structural connectivity of the implant can be modified upon activation of the release mechanism. Systems and methods of using the same are disclosed.
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http://www.ckcest.cn/home/
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