A pressure sensor including a substrate having a first housing defining a gas-filled interior cavity arranged thereon. An elastic sealing element is attached to a free end of the first housing and generally covers an open end of the interior cavity for sealing the interior cavity with respect to an external environment. A portion of the elastic sealing element is configured to be moveable in response to a pressure acting thereon. A semiconductor die is arranged on the substrate and defines a pressure sensing diaphragm exposed to the gas occupying the interior cavity.
