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TRANSDERMAL MICRONEEDLE ARRAY PATCH
专利权人:
RichHealth Technology Corporation;Richtek Technology Corporation
发明人:
Jung-Tang Huang,Kuan-Ting Lee,Dahong Qian
申请号:
US15939772
公开号:
US20180279929A1
申请日:
2018.03.29
申请国别(地区):
US
年份:
2018
代理人:
摘要:
Provided is a transdermal microneedle array patch, including: a bottom cover; a top cover; a substrate disposed within the top cover; and a first probe and a second probe disposed between the bottom cover and the top cover and electrically connected the substrate. The first and second probes form an open circuit. While the bottom cover is combined with the top cover to form the transdermal microneedle array patch, the first and second probes form a closed circuit.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/
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