A method for manufacturing a wound dressing having a substrate, and a wound dressing manufactured by such a method are disclosed. The method comprises providing a sacrificial layer of material to be perforated by means of a hot pin perforator, in order to remove any molten residues on the heated pins of the hot pin perforator, before the same pins are used to make holes in the substrate. The presented method is cost effective, robust and reduces the risk of contaminating substances being embedded in the substrate during the hole making process.
