Darley, Derek Ian,McCusker, Desmond Andrew,Milojevic, Dusan,Parker, John L.
申请号：
AU2011201190
公开号：
AU2011201190B2
申请日:
2011.03.16
申请国别(地区):
AU
年份:
2013
代理人:
摘要：
#$%^&*AU2011201190B220130117.pdf#####ABSTRACT A method (10) of forming an electrically conducting feedthrough. The method (10) comprises a first step (11) of forming an electrically conductive structure (21) comprising a sacrificial component and a non-sacrificial component. At least a portion of the non-sacrificial component can then be coated with a relatively electrically insulating material (35) prior to removal of at least a portion of the sacrificial component from the electrically conductive structure. The structure of the feedthrough provides electrical connection through the wall of a housing of an implantable component while preventing unwanted transfer of materials between the interior of the component and the surrounding environment.1/13 2F/C 2 FG. 3
