MAX-PLANCK-GESELLSCHAFT ZUR FÖRDERUNG DER WISSENSCHAFTEN E.V.
发明人:
Hyeon-Ho Jeong,Tung Chun Lee,Peer Fischer
申请号：
US15562221
公开号：
US20180117560A1
申请日:
2016.03.23
申请国别(地区):
US
年份:
2018
代理人:
摘要：
The present invention relates to a method for encapsulating a nanostructure, the method comprising the steps of:providing a substrate；forming a plug composed of plug material at said substrate；forming a nanostructure (on or) at said plug；forming a shell composed of at least one shell material on external surfaces of the nanostructure, with the at least one shell material covering said nanostructure and at least some of the plug material, whereby the shell and the plug encapsulate the nanostructure. The invention further relates to a coated nanostructure and to the use of a coated nanostructure.
