Method for producing a hollow body formed by a pair of wafers (2, 2a), welded together along respective mating annular surfaces (4), by applying an aqueous moistening liquid to at least one of the mating surfaces of the wafers, previously subjected to baking, and by adhesion by mutual contact of said surfaces, characterized in that the moistening liquid is applied to said at least one surface in the form of separate and distinct droplets (G) by pulsed-jet deposition means, creating a relative motion between said jet deposition means and said wafers along the annular profile of said surfaces.
