Disclosed are devices, systems and methods for treating an incision. The device includes a generally planar tension relief module, comprising a central structure in fluid communication with the incision, wherein at least a portion of the central structure is adapted to be aligned with a longitudinal axis of the incision； and opposing adhesive structures coupled to the central structure and a flexible sealant structure comprising a lower adhesive surface and sized to seal over the tension relief module forming a sealed flow pathway. The opposing adhesive structures are adapted to be stretched from a relaxed configuration to a first tensile configuration and to return towards the relaxed configuration from the first tensile configuration into a second tensile configuration and impart a contracting force in a direction that is towards the opposing adhesive structure.
