Gera Strommer,Avi Broder,Moti Mocha,Robert S. Fishel,Nahum Natan
申请号：
US15822792
公开号：
US20180078774A1
申请日:
2017.11.27
申请国别(地区):
US
年份:
2018
代理人:
摘要：
An encapsulation configuration for electronic components in a flexible implantable medical device, including at least one set of folded circuit boards and a filler material, the set of folded circuit boards including a plurality of circuit boards and a plurality of connection cables, each one of the circuit boards including at least one electronics component, each one of the circuit boards having a generally rectangular shape, the connection cables electrically coupling adjacent ones of the circuit boards and the circuit boards being folded over one another in a pleated manner, the filler material surrounding the set of folded circuit boards, the filler material and the set of folded circuit boards together having a cylindrical shape, the set of folded circuit boards being positioned lengthwise in the cylindrical shape and the electronics component being positioned on the set of folded circuit boards to achieve optimal volume consumption in the electronics encapsulation.
