The present application is directed, at least in part, to a process for forming droplet interface blayers (DIBs). In one or more embodiments, a housing is produced wherein the housing includes at least one aperture that comprises a cis portion and a trans portion, at least one cis electrode receptacle and at least one trans electrode receptacle, wherein the cis electrode receptacle is operatively connected to the cis portion, and the trans electrode receptacle is operatively connected to the trans portion. In at least one embodiment, the number of cis and trans electrode receptacles equals the number of apertures. Electrodes are treated with a buffer and then inserted into each of the cis and trans electrode receptacles.
