ПЬЮ Рэндалл Б. (US),ОТТС Дэниел Б. (US),ПАНДОДЖИРАО-С Правин (US),ТОНЕР Адам (US),РАЙЕЛЛ Джеймс Дэниел (US),КЕРНИК Эдвард Р. (US),БИТОН Стефен Р. (US),ФЛИТШ Фредерик А. (US)
申请号：
RU2012155576/14
公开号：
RU2012155576A
申请日:
2012.12.20
申请国别(地区):
RU
年份:
2014
代理人:
摘要：
1. A method of forming electrical connections to the three-dimensional surface, comprising: forming a three-dimensional substrate bases from the first insulating material applying a conductive film on at least part of the surface of the bases of the three-dimensional substrate and forming a conductor providing an electrical connection from the conductive film by laser ablation of the conductive material surrounding plenki.2. A method according to Claim. 1 further comprising the step of applying a second insulating material formed on the conductor providing electrical soedinenie.3. A method according to claim. 2, further comprising the step of forming electrical contact openings in the second insulating material by laser ablyatsii.4. A method according to Claim. 1 further comprising the step of introducing a three-dimensional substrate with electrical connections in ophthalmology ustroystvo.5. A method according to Claim. 1 further comprising the step of introducing a three-dimensional substrate with electrical connections at the insertion device for an ophthalmic linzy.6. A method of forming electrical connections to the three-dimensional surface, comprising: forming a three-dimensional substrate of a first insulating material, forming a three-dimensional mask of a second material, wherein the three-dimensional mask can fit snugly to the three-dimensional substrate, forming openings through the areas in the three-dimensional mask by laser ablation room dimensional mask a three-dimensional substrate and applying a conductive film on a combined three-dimensional and three-dimensional mask podlozhku.7. A method according to claim. 6, wherein the first insulating material is identical to the second materialu.8. A method according to claim. 6, complement1. Способ формирования электрических соединений на трехмерной поверхности, содержащий:формирование трехмерной основы подложки из первого изолирующего материалананесение проводящей пленки по меньшей мере на часть поверхнос
