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SURFACE MICROSTRUCTURÉE
专利权人:
Hoowaki, LLC;BVW Holding AG
发明人:
申请号:
EP16828206.9
公开号:
EP3390273A4
申请日:
2016.07.01
申请国别(地区):
EP
年份:
2019
代理人:
摘要:
A substrate having an undulating surface forming a series of rounded peaks and valleys that produce a continuously curving surface across at least a portion of the substrate. The undulating surface defines a first set of micro features. A second set of micro features molded on the first set of micro features. The substrate is a compression molded polymeric material in which the first and second sets of micro features are formed on the substrate during a single molding step, and wherein the first and second sets of micro features cooperate to increase the surface area and affect at least one of adhesion, friction, hydrophilicity and hydrophobicity of the substrate.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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