COLBURN DAVID J.,JOHNSON ERIK J.,BRANDWEIN DAVID H.,GYSBERS JEROME E.,YOUNG PATRICK J.,CANTOR ADAM S.
申请号：
IN2643CHN2014
公开号：
IN2643CHN2014A
申请日:
2014.04.08
申请国别(地区):
IN
年份:
2015
代理人:
摘要：
The present disclosure provides a low profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient s skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an applicator device. The carrier assembly is at least releasably secured to the housing and it is typically not attached or otherwise fixed to any portion of the applicator device.
