Dao Min Zhou,James Singleton Little,Robert J. Greenberg
申请号：
US11821327
公开号：
US09220169B2
申请日:
2007.06.21
申请国别(地区):
US
年份:
2015
代理人:
摘要：
Device is a hermetically sealed electronics package bonded to an electrode or flexible circuit that is suitable for implantation such as for a retinal or cortical electrode array. The hermetically sealed electronics package is bonded to the electrode or flexible circuit by electroplating a biocompatible material, such as platinum or gold, forming a plated connection, bonding the flexible circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation. The device comprises a substrate containing a contact, a flexible assembly containing a pad, and electroplated bonding between said contact and said pad that bonds said substrate and said flexible assembly together.
