A method of manufacturing a plurality of through-holes in a layer of first material, for example for the manufacturing of a probe comprising a tip containing a channel. To manufacture the through-holes in a batch process,a layer of first material is deposited on a wafer comprising a plurality of pitsa second layer is provided on the layer of first material, and the second layer is provided with a plurality of holes at central locations of the pits；using the second layer as a shadow mask when depositing a third layer at an angle, covering a part of the first material with said third material at the central locations, andetching the exposed parts of the first layer using the third layer as a protective layer.
