The present invention relates to an interspinous integration type implant. Provided is an interspinous integration type implant which is an implant inserted between an upper spinous process and a lower spinous process and comprises: a spacer to which one end of an upper plate and one end of a lower plate are connected so as to be formed in a "ㄷ" shape or "U" shape, and which is inserted between spinous processes in order to provide elasticity an upper spinous process coupling means for tightly coupling the upper plate to the upper spinous process and a lower spinous process coupling means for tightly coupling the lower plate to the lower spinous process, wherein the upper plate comprises at least one osseointegration hole formed to penetrate the top surface and the bottom surface of the upper plate so as to be moved by being integrated with the upper spinous process, and the lower plate comprises at least one osseointegration hole formed to penetrate the top surface and the bottom surface of the lower plate so as to be moved by being integrated with the lower spinous process. The interspinous integration type implant according to the present invention provides elasticity to the upper spinous process and the lower spinous process, thereby maintaining a space between the upper and lower spinous processes. Also, the interspinous integration type implant moves by being integrated with the upper and lower spinous processes through the osseointegration holes formed at the upper plate and the lower plate, and thus does not damage the spinous processes and has an effect of preventing a separation phenomenon from between the spinous processes. Also, the interspinous integration type implant has an effect of enabling minimally invasive surgery since blades can be rotated and tightened using an instrument after inserting the interspinous integration type implant from the side surface of spinous processes. Furthermore, after inserting the interspinous integration type implant b
