Inspection method for semiconductor wafer and apparatus for reviewing defects

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专利权人:

Kenji Obara

发明人:

Kenji Obara,Takehiro Hirai

申请号：

US12352357

公开号：

US08309919B2

申请日:

2009.01.12

申请国别(地区):

US

年份:

2012

代理人:

摘要：

An object of the present invention is to provide a suitable method of observing a wafer edge by using an electron microscope. The electron microscope includes a column which can take an image in being tilted, and thus allows a wafer edge to be observed from an oblique direction.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/