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INDIRECT BONDING APPARATUS
专利权人:
CHOICE BIOTECH INC.
发明人:
TAI-HONG KUO,TZU-CHIEH WU
申请号:
US15992618
公开号:
US20180344431A1
申请日:
2018.05.30
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An indirect bonding apparatus has a first positioning member and at least one second positioning member. The first positioning member is made by 3D printing after digital planning and has a body and at least one connecting seat disposed on the body. The at least one second positioning member is detachably inserted into the at least one connecting seat of the first positioning member. Each second positioning member has a guiding seat and a positioning frame. The guiding seat is slidably inserted into the at least one connecting seat. The positioning frame is erectly formed on the guiding seat and is adjacent to a front surface of the guiding seat. A positioning groove is formed between the body and the positioning frame of the at least one second positioning member.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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