A novel array of hollow silica glass microneedles is provided. The array is prepared from a silica dispersion. A novel apparatus is provided comprising a negative mold component having tapered openings therein and a positive mold component having positive elements that are received within the tapered openings of the negative mold component. An assembly is prepared of the negative mold component and the positive mold component, with an aqueous silica dispersion received within the space between the outer surface of the positive elements and the inner surface of the openings. The assembly is heated to remove air and water vapors from the silica dispersion, then the assembly is further heated to sinter the remaining silica to silica glass. The sintered silica glass when removed from the mold components is in the form of an array of microneedles.
