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Emanation system and method for use
专利权人:
S.C. Johnson & Son; Inc.
发明人:
Maude Christian Meier,Fei Gao,Randy C. Yuhas
申请号:
US14309549
公开号:
US09522209B2
申请日:
2014.06.19
申请国别(地区):
US
年份:
2016
代理人:
摘要:
An emanation system is disclosed that include a substrate, a secondary substrate, and an air treatment material. The secondary substrate is adapted to be wetted with runoff from the air treatment material applied to the substrate. When applied, the air treatment material emanates from the substrate at a first release rate and from the secondary substrate at a second release rate.
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