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Feedthrough assembly including electrical ground through feedthrough substrate
专利权人:
Rajesh V. Iyer
发明人:
Rajesh V. Iyer,Simon E. Goldman,Thomas P. Miltich
申请号:
US13346424
公开号:
US08644936B2
申请日:
2012.01.09
申请国别(地区):
US
年份:
2014
代理人:
摘要:
A feedthrough assembly may include a ferrule defining a ferrule opening, a capacitive filter array at least partially disposed within the ferrule opening, and a feedthrough at least partially disposed within the ferrule opening. In some examples, the capacitive filter array includes a filter array ground conductive pathway. In some examples, the feedthrough includes a feedthrough ground conductive via. The feedthrough ground conductive via may be electrically coupled to the filter array ground conductive pathway, and the feedthrough ground conductive via may be electrically coupled to the ferrule.
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