A chip package stack up includes a processor chip package that has a top surface and a bottom surface, an interposer, disposed above and connected to the processor chip package top surface; a memory chip package disposed above the interposer and connected to the processor chip package through the interposer; and a processor chip package heat spreader having a bottom surface adhered to the processor chip package top surface, and having an extending portion that extends outwardly from an edge of the processor chip package.
