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Adhesive resin layer and adhesive resin film
专利权人:
FUJIMORI KOGYO CO.; LTD.
发明人:
Shiro Fujita,Atsushi Suzuki,Hiroto Niimi
申请号:
US15549864
公开号:
US10544333B2
申请日:
2016.02.29
申请国别(地区):
US
年份:
2020
代理人:
摘要:
The present invention provides an adhesive resin layer and an adhesive resin film which can prevent generation of air bubbles even when they are thermally deformed after adhering to a substrate, and have good followability to deformation of a substrate of a laminate in which a substrate, an adhesive resin layer, and a substrate are laminated in an order. More particularly, the present invention is a monolayered adhesive resin layer comprising an acrylic-based adhesive resin composition, wherein the adhesive resin composition contains at least an acrylic-based polymer, an acrylic-based monomer or an acrylic-based oligomer, and a thermopolymerization initiator, the adhesive resin layer has pressure sensitive adhesiveness on both surfaces at an ambient temperature, and in differential scanning calorimetry at a temperature raising rate of 10° C./min, heat generation is observed at 80° C. or higher, and at least one peak is confirmed between 120° C. and 210° C.
来源网站:
中国工程科技知识中心
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http://www.ckcest.cn/home/

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