Stefan Bokorny,Tobias Maienfisch,Stefan Loher,Wendelin J. Stark
申请号：
US13518569
公开号：
US20120321686A1
申请日:
2009.12.24
申请国别(地区):
US
年份:
2012
代理人:
摘要：
The present invention relates to antifungal materials, particularly to nanoparticles comprising or consisting of a non-persistent inorganic support material such as Tricalciumphosphate (TCP) and copper as a dopant in the form of Cu+/−0, Cu+1 and or Cu+2 to composite materials or liquid formulations containing such nanoparticles. Further, the invention relates to the manufacture of such nanoparticles, composites, liquid formulations and to the use of such nanoparticles, composites, liquid formulations as an antifungal component.
