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HEARING AID MOLD
专利权人:
发明人:
申请号:
EP12848958.0
公开号:
EP2779974A1
申请日:
2012.11.16
申请国别(地区):
EP
年份:
2014
代理人:
摘要:
A mold for earpiece devices either to connect an earphone to the ear canal or to act as a cover or plug thereof, allowing to prevent the development of ear diseases comprising: a mold placed in the ear canal and/or ear shell, adjusted to its shape, and whose external border is in direct contact with the users skin and a metallic piece with biocide properties, located inside the mold at a distance close to the border thereof wherein the metallic piece is adjusted from inside the mold (10) to the shape of the external contour thereof, allowing that only the mold is in direct contact with the skin, and encompassing all the zones where contact is produced.
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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