A process for fixing an implant to a balloon includes providing, in an interior of a sleeve, a heated balloon having a pressurizable balloon interior and an implant crimped to the balloon. The implant has a supporting structure with a multiplicity of through openings. A negative pressure is applied in the interior of the sleeve and a positive pressure is applied to the balloon interior, so that the balloon is deep-drawn into the openings of the implant, producing a form-locking connection between the balloon and the implant. A configuration for carrying out the process and an apparatus for fixing an implant to a balloon are also provided.
