A medical device and method of making the medical device are disclosed. The medical device includes a sensor having an interconnect. The interconnect has a first conductive layer, an insulation layer, and a second conductive layer separated from the first conductive layer by the insulation layer. An electrical contact is provided that is electrically connected to the second conductive layer and is contactable from the side of the interconnect that opposes the second conductive layer. The electrical contact is provided free of micro-vias. The medical device also includes an electronics assembly having an electrical connector, the electronics assembly configured to mate with the interconnect to establish an electrical connection between the electrical connector and the first conductive layer via the electrical contact.
