Kaustubh Ravindra Nagarkar,Jeffrey Michael Ashe,Eric Patrick Davis,Nancy Cecelia Stoffel
申请号：
US15625740
公开号：
US20180235544A1
申请日:
2017.06.16
申请国别(地区):
US
年份:
2018
代理人:
摘要：
A system includes an implantable sensor assembly. The implantable sensor assembly includes a housing. The housing includes a substrate layer comprising an interior surface and an exterior surface, and a cap layer, wherein the substrate layer and the cap layer are coupled to form an enclosed cavity that at least partially encloses the interior surface of the substrate layer within the cavity and wherein both the substrate layer and the cap layer are formed from an insulating material. The implantable sensor assembly also includes one or more electronic components disposed within the cavity of the housing and one or more probes disposed on the exterior surface of the substrate layer and electrically coupled to the one or more electronic components by one or more electrical connections extending through the housing.
