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Wafer-scale package including power source
专利权人:
发明人:
Richard J OBrien,John K Day,Paul F Gerrish,Michael F Mattes,David A Ruben,Malcolm K Grief
申请号:
US15079957
公开号:
US09431312B2
申请日:
2016.03.24
申请国别(地区):
US
年份:
2016
代理人:
摘要:
A medical device includes a first substrate, a second substrate, a control module, and an energy storage device. The first substrate includes at least one of a first semiconductor material and a first insulating material. The second substrate includes at least one of a second semiconductor material and a second insulating material. The second substrate is bonded to the first substrate such that the first and second substrates define an enclosed cavity between the first and second substrates. The control module is disposed within the enclosed cavity. The control module is configured to at least one of determine a physiological parameter of a patient and deliver electrical stimulation to the patient. The energy storage device is disposed within the cavity and is configured to supply power to the control module.
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