Described herein are methods and apparatus for cutting a material including biological tissue. The apparatus has a cutting electrode with an elongate cutting portion. A voltage pulse waveform (typically comprising repeated bursts of minipulses) having a low or very low duty-cycle is applied to the cutting electrode to cut the tissue or other material by producing a vapor cavity around the cutting portion of the electrode and ionizing a gas inside the vapor cavity to produce a plasma. A low duty cycle cutting waveform may prevent heat accumulation in the tissue, reducing collateral thermal damage. The duration of the burst of minipulses typically ranges from 10 μs to 100 μs, and the rep rate typically ranges from 1 KHz to 10 Hz, as necessary. The apparatus and method of invention may cut biological tissue while decreasing bleeding and maintaining a very shallow zone of thermal damage.
