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Hip Orthotic Configured for Thermal Packs
专利权人:
Bryan E. Kilbey
发明人:
Bryan E. Kilbey
申请号:
US16160092
公开号:
US20200113724A1
申请日:
2018.10.15
申请国别(地区):
US
年份:
2020
代理人:
摘要:
A hip joint orthotic that can be used in stages. In the first stage the orthotic includes a stiff relatively brace assembly that can limit the amount of allowed flexion, extension, abduction, and adduction. In the second stage the relatively stiff brace can be removed and the orthotic can be used as a soft wrap. In both stages the orthotic is configured to easily mount and retain a thermal pack in a desired position or positions. In many instances the thermal pack will be a cold pack, but in some cases a hot pack may be used as well.
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中国工程科技知识中心
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