A kit for removing an embedded wire from tissue includes a dissector instrument for dissecting tissue surrounding an embedded wire and a pulling instrument for pulling the embedded wire from the tissue. The dissector instrument includes a proximal portion with a first and second handle and a distal portion. The distal portion of the dissector instrument includes a tubular section for surrounding an embedded wire. The pulling instrument includes a proximal portion with a first and second handle and a distal portion. The distal portion of the pulling instrument includes an elongated clamp for coupling to the embedded wire for extraction. The dissector instrument and pulling instrument may be used together as a kit, or separately to extract embedded wire from tissue.
