A method for bonding a first member (cover plate), having a first bonding surface formed from a cycloolefin polymer, to a second member (electrode plate), having a second bonding surface formed from a metal, the method comprising a step for exposing the first bonding surface and the second bonding surface to H2O plasma and/or O2 plasma (step S21), and a step for aligning the first bonding surface and the second bonding surface (step S22).本發明提供一種將第1構件(覆蓋板)與第2構件(電極板)接合的方法，上述第1構件(覆蓋板)具有由環烯烴聚合物形成之第1被接合面，上述第2構件(電極板)具有由金屬形成之第2被接合面，且具備以下步驟：將第1被接合面及第2被接合面暴露於H2O電漿及O2電漿中之至少一者(步驟S21)；及合併第1被接合面與第2被接合面(步驟S22)。
