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Method of coupling a feedthrough assembly for an implantable medical device
专利权人:
Heraeus Precious Metals GmbH & Co. KG
发明人:
Jacob Markham,Ulrich Hausch,Goran Pavlovic
申请号:
US13902287
公开号:
US09431801B2
申请日:
2013.05.24
申请国别(地区):
US
年份:
2016
代理人:
摘要:
One aspect is a method of coupling a feedthrough assembly to a surrounding case of an implantable medical device. An insulator having a plurality of conducting elements extending therethrough is provided. The insulator is placed with conducting elements within an opening of a case, thereby defining a narrow space between the insulator and the case. A braze preform is placed adjacent the insulator and case in the narrow space. The insulator is heated with a laser until raising the temperature of the adjacent preform above its melting point such that it fills the space between the insulator and the case.
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