Jonathan M. Rothberg,Keith G. Fife,Tyler S. Ralston,Gregory L. Charvat,Nevada J. Sanchez
申请号：
US15638331
公开号：
US20170296144A1
申请日:
2017.06.29
申请国别(地区):
US
年份:
2017
代理人:
摘要：
To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and a high-speed serial data module may be used to move data for all received channels off-chip as digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. Various novel waveform generation techniques, transducer configuration and biasing methodologies, etc., are likewise disclosed. HIFU methods may additionally or alternatively be employed as a component of the “ultrasound-on-a-chip” solution disclosed herein.
