Jerry Ok;Dau Min Zhou;Robert J. Greenberg;Neil Talbot;Gaillard R. Nolan;Alfred E. Mann
发明人:
Robert J. Greenberg,Alfred E. Mann,Neil Talbot,Jerry Ok,Gaillard R. Nolan,Dau Min Zhou
申请号：
US12861729
公开号：
US08121697B2
申请日:
2010.08.23
申请国别(地区):
US
年份:
2012
代理人:
摘要：
The invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue, for a retinal or cortical electrode array to enable restoration of sight to certain non-sighted individuals. The hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material, such as platinum or gold, effectively forming a plated rivet-shaped connection, which bonds the flex circuit to the electronics package. The resulting electronic device is biocompatible and is suitable for long-term implantation in living tissue.
