Ron A. Balczewski,James E. Blood,William J. Linder,Jacob M. Ludwig,Keith R. Maile
申请号：
US15863177
公开号：
US20180185655A1
申请日:
2018.01.05
申请国别(地区):
US
年份:
2018
代理人:
摘要：
This document discusses, among other things, systems and methods to fabricate and operate an implantable medical device. The implantable medical device can include a housing portion defining an interior chamber. The implantable medical device can include a circuit in the interior chamber. The implantable medical device can include a first electronic component that is not in the interior chamber. The implantable medical device can include a substrate coupled to the housing, the substrate including a first via extending through the substrate, the first via electrically coupling the first electronic component to the circuit.
