PROBLEM TO BE SOLVED: To provide a method for manufacturing a metal grating, by which a metal part of a grating can be more densely formed by an electroforming process using a silicon (Si) substrate, and to provide a metal grating and an X-ray imaging device.SOLUTION: A metal grating DG includes a first Si part 11 and a grating 12 formed thereon and comprising a second Si part 12a and a metal part 12b alternately arranged parallel to each other. The second Si part 12a has a first insulating layer 12c between the Si part and the metal part 12b, and has a second insulating layer 12d at the top. The method for manufacturing the metal grating DG comprises: forming a resist layer on a silicon substrate patterning and removing the resist layer by a lithographic process etching the substrate where the resist layer is removed, to a predetermined depth H by an etching process as well as etching the substrate to be broader than the removed part to form a recessed part (for example, a slit groove or the like) forming an insulating layer on an inner surface of the recessed part removing the insulating layer on the bottom of the recessed part and filling the recessed part with metal by an electroforming process.COPYRIGHT: (C)2013,JPO&INPIT【課題】本発明は、シリコン(Si)基板を用い電鋳法で格子の金属部分をより緻密に形成し得る金属格子の製造方法、金属格子およびX線撮像装置を提供する。【解決手段】金属格子DGは、第1Si部分11とこの上に形成され第2Si部分12aおよび金属部分12bを交互に平行に配設した格子12とを備え、第2Si部分12aは、金属部分12bとの間に第1絶縁層12cを有し、その頂部に第2絶縁層12dを有している。金属格子DGの製造方法では、シリコン基板上にレジスト層が形成され、これがリソグラフィー法でパターニングして除去され、所定のエッチング法で除去部分を所定の深さHまでエッチングしつつ前記除去部分よりも幅広にエッチングして凹部(例えばスリット溝等)が形成され、この凹部の内表面に絶縁層が形成され、凹部の底部の絶縁層が除去され、そして、電鋳法で凹部が金属で埋められる。【選択図】図1
