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貼付剤および貼付製剤
专利权人:
日東電工株式会社
发明人:
播摩 潤,櫻庭 怜平
申请号:
JP2006192346
公开号:
JP5005277B2
申请日:
2006.07.13
申请国别(地区):
JP
年份:
2012
代理人:
摘要:
PROBLEM TO BE SOLVED: To obtain a patch and a patch preparation which have no contamination, no mechanical damage and no heat damage in an adhesive layer just before use and high stability of adhesive layer with time and easily retain shapes as patch and patch preparation, easily release liners and have excellent operability.SOLUTION: The patch is equipped with a substrate 1, an adhesive layer 2 formed on one side of the substrate and a liner 3 which is laminated to the adhesive layer and has thickness T. The liner is provided with a groove 4 having depth from the surface at the opposite side of the adhesive layer laminated surface of &geT/2 and
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

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