A cloth electronization product and method. The cloth electronization product at least comprises packaging cloth (1) or a hot melt adhesive film as a circuit board at least comprises an electronic component (3) and at least comprises a thread (2) connected to a conductive region (5) of the electronic component. After being connected to the thread the electronic component is sewed on the packaging cloth or the hot melt adhesive film or in a process that the thread is pasted or sewed on the packaging cloth or the hot melt adhesive film the electronic component is connected to the thread and then the packaging cloth is sewed on garment cloth (1 ) or the hot melt adhesive film is melted in the packaging cloth or the garment cloth. The original structure of the hot melt adhesive film disappears and a miniaturization effect of the hot melt adhesive film is generated. Through the foregoing two methods composing packaging an insulation effect and a wiring process of garment electronization can be implemented.
