Copper-containing material for the treatment of wounds, burns and other skin conditions

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专利权人:

カプロン インコーポレイテッド

发明人:

ガベイ、ジェフリー

申请号：

JP2007539711

公开号：

JP5275629B2

申请日:

2005.11.07

申请国别(地区):

JP

年份:

2013

代理人:

摘要：

The invention provides a method for treating and healing sores, cold sores, cutaneous openings, ulcerations, lesions, abrasions, burns and skin conditions comprising applying to a body surface exhibiting the same, a material incorporating water-in-soluble copper compounds which release cu+ ions, cu++ ions or combinations thereof upon contact with a fluid to effect the treatment and healing thereof.

来源网站：

中国工程科技知识中心

来源网址：

http://www.ckcest.cn/home/