A lens structure is provided. The lens structure includes an image capturing module, a circuit board and a light module. The image capturing module includes a plurality of optical lenses and an optical sensor. The circuit board includes an upper board and a lower board. The lower board is connected to bottom of the upper board. The image capturing module is disposed on top surface of the upper board. The light module includes a light board, at least a light unit and at least a FPC. The light unit is a flat hollow ring structure. Furthermore, The FPC is connected to the lower board and is removable. The image capturing module, the upper board, and the light module are located by an encapsulation gel. The encapsulation gel is covered by a casing structure.本新型為一種鏡頭結構,鏡頭結構包括一影像擷取模組、一電路基板及一光源模組。影像擷取模組是由多個光學鏡片及一光感測元件所組成。電路基板包括一上部基板及一下部基板,下部基板是連接在上部基板的下方,且影像擷取模組設置於上部基板的上方表面。光源模組包括一燈板、至少一發光單元及至少一軟式電路板。燈板為一扁形狀的中空環狀結構。此外,軟式電路板是以可拆卸的方式電性連接該下部基板。其中,影像擷取模組、上部基板及光學膜組是使用一封裝膠體進行定位,且封裝膠體被一殼體結構所包覆著。20‧‧‧鏡頭結構22‧‧‧光源模組221‧‧‧燈板222‧‧‧發光單元223‧‧‧軟式電路板(FPC)23‧‧‧影像擷取模組231‧‧‧光學鏡片232‧‧‧光感測元件24‧‧‧電路基板241‧‧‧上部基板242‧‧‧下部基板25‧‧‧封裝膠體26‧‧‧殼體結構
