A connector is described herein that includes a plurality of layers patterned in two dimensions and joined in a stack with a bore there through. At least a subset of the plurality of layers are contact layers that include deflectable members (e.g., springs) that deflect in plane or out of plane upon insertion of a lead into the bore through the connector. The deflectable members form redundant electrical connections with the lead when the lead is inserted into the bore. For example, the connector can be incorporated into an implantable medical device (e.g., IPG). Moreover, methods of manufacturing a connector are set forth herein.
