A method of fabricating a MEMS flexible substrate neural probe is provided. The method can include applying an insulation layer on a substrate, and depositing a plurality of metal traces on the insulation layer and electroplating each of the plurality of traces. The method also can include encapsulating the insulation layer and metal traces deposited thereon with an insulation layer. Additionally the method can include etching the insulation layer to form a plurality bond pad sites and probes to form a flexible ribbon cable having a plurality of bond pad sites disposed on a surface of the flexible cable and a plurality of neural probes extending from the flexible cable. The method further can include separating the substrate from the insulation layer and depositing insulation on each of the neural probes, each probe comprising insulated portion and exposed metallic tip. Moreover, the method can include cutting each of the exposed metallic tips, and plating each of the exposed metallic tips and each of the plurality of bond pad sites.
