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Thin-film electrode assembly with soft overmold
专利权人:
Verily Life Sciences LLC
发明人:
Brian Pepin,Shiv Sabesan,Bo Lu
申请号:
US15597187
公开号:
US10478617B2
申请日:
2017.05.17
申请国别(地区):
US
年份:
2019
代理人:
摘要:
The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire. The electrode has a top surface that is raised above a top surface of the overmold by a predetermined distance.
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中国工程科技知识中心
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http://www.ckcest.cn/home/

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