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PHOTOSENSITIVE RESIN COMPOSITION
专利权人:
Rohm and Haas Electronic Materials LLC
发明人:
Kushida Shugaku,Haga Mitsuru,Kainuma Kunio
申请号:
US201615736871
公开号:
US2018174701(A1)
申请日:
2016.07.13
申请国别(地区):
美国
年份:
2018
代理人:
摘要:
To provide a photosensitive resin composition capable of preventing ion migration while having satisfactory developability and having no cissing. The photosensitive resin composition comprises a reactive polymer having an ethylenically unsaturated double bond group and a carboxyl group; a free radical-based stabilizer; and a photoacid generator. The acid value of the reactive polymer is 40 to 100 mgKOH/g. The chlorine content of the reactive polymer is equal to or less than 150 ppm. The free radical-based stabilizer is selected from a hindered amine or hindered amine derivative. A cured product is obtained by using the photosensitive resin composition.
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