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ENDOSCOPE, IMAGE PICKUP MODULE, AND MANUFACTURING METHOD OF IMAGE PICKUP MODULE
专利权人:
OLYMPUS CORPORATION
发明人:
Jumpei YONEYAMA
申请号:
US15935210
公开号:
US20180220051A1
申请日:
2018.03.26
申请国别(地区):
US
年份:
2018
代理人:
摘要:
An endoscope includes an image pickup module placed in a distal end portion, the image pickup module including an image pickup device to which a cover glass is bonded, a positioning bump placed on the image pickup device, and a recessed portion formed in the cover glass, an upper portion of the positioning bump being inserted into the recessed portion, and a relative position in three axial directions of the image pickup device and the cover glass being defined by an abutment position of the positioning bump and the recessed portion.
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