您的位置: 首页 > 农业专利 > 详情页

晶片組之包覆固定裝置
专利权人:
LTD.;GHI FU TECHNOLOGY CO.
发明人:
LIN, LI-QI,林豊棋
申请号:
TW104205637
公开号:
TWM507279U
申请日:
2015.04.15
申请国别(地区):
TW
年份:
2015
代理人:
摘要:
Device is coated and fixed in a kind of chipset, its be include that several encapsulated layers are respectively coated by several chips, and this etc. encapsulation interlayer system be equipped with number connection ribs, thereby, the chip of the grade encapsulated layers is coated with through grade connection rib connection, so that large area hollow out is formed between the encapsulated layer what equal chips, to reach the effect that gas permeability is substantially improved, to improve the comfort that wearing uses chipset.一種晶片組之包覆固定裝置,其係包含有數封裝層分別包覆數晶片,且該等封裝層間係設有數連接肋,藉此,透過該等連接肋連接包覆有該等封裝層之晶片,俾使封裝層於該等晶片間形成大面積鏤空,以達到大幅提升透氣性之效果,從而提高穿戴使用晶片組的舒適性。
来源网站:
中国工程科技知识中心
来源网址:
http://www.ckcest.cn/home/

意 见 箱

匿名:登录

个人用户登录

找回密码

第三方账号登录

忘记密码

个人用户注册

必须为有效邮箱
6~16位数字与字母组合
6~16位数字与字母组合
请输入正确的手机号码

信息补充